Amandla Amatsha

Isicelo ekuveliseni iibhetri ze-aluminium shell

Ukuwelda nge-ultrasonic yobhedu, i-aluminium kunye nezinye iintsimbi ezingezizo i-ferrous yinkqubo yokudibanisa evuthiweyo, esetyenziswa kakhulu kwiimoto, kwii-elektroniki zabathengi nakwamanye amacandelo. Ngenxa yophuhliso olukhawulezileyo lwezithuthi zombane ezintsha zamandla, imfuno yeebhetri ze-lithium-ion nayo iyanda, kwaye ukusetyenziswa kokuwelda nge-ultrasonic yobhedu kunye neefoyile ze-aluminium nako kuye kwanda kakhulu.

Uqhagamshelo oluthembekileyo lweentambo zeVolthi ephezulu kwizithuthi zombane

Imoto yombane esetyenziswa kwizithuthi zombane kufuneka ikwazi ukubonelela ngamandla apheleleyo xa iqalisa. Oku kufuna uqhagamshelo oluthembekileyo lweentambo ze-voltage ephezulu kwisithuthi. Iintambo kunye neeplagi phakathi kwesithuba sokutshaja kunye nebhetri ye-voltage ephezulu zifuna uqhagamshelo oluthembekileyo olune-contact resistance ephantsi ukuze itshaje ngokukhawuleza. Iinjineli zoyilo zifuna ububanzi be-solder obuncinci kangangoko kunokwenzeka ukuze kongiwe indawo yokufaka. Nangona kunjalo, oku kunzima ukufezekiswa ngeendlela zesiqhelo, kwaye uqhagamshelo oluthembekileyo ngoku lunokufezekiswa lula ngokusebenzisa i-ultrasonic welding.

Ukuwelda kwe-Ultrasonic kweebhetri zePakethi eguquguqukayo kunye nee-Power Semiconductors

Ukuwelda kweefoyile zekopolo kunye ne-aluminiyam kwiibhetri zepakethi eziguquguqukayo kukwayindlela eqhelekileyo yokuwelda ye-ultrasonic. Enye inkqubo yokuwelda ye-ultrasonic isetyenziselwa ukuvelisa ii-semiconductors zamandla ze-IGBT. Ii-IGBT zizinto eziphambili ze-elektroniki ezitshintsha umbane ngokukhawuleza kwaye zilahleko oluncinci kwaye zisetyenziswa njengeziguquli zamandla kwiidrayivu zombane kunye neenkqubo zokutshaja iibhetri. I-Ultrasound ifanelekile ngakumbi kwi-welding ye-IGBT kwii-substrates ze-ceramic ezinobuthathaka.